Principal Engineer - Mechanical

Astronautics/Kearfott Corporation    Little Falls, NJ
Job Description

Kearfott Corporation, a global avionics, motion control and navigation supplier for over 100 years, is a leader in the design and manufacture of precision motion control products and inertial control components. Our inertial guidance and navigation systems control military and commercial aircraft, military land vehicles, missiles, marine vehicles, satellites, and space instruments.

Candidate will be a key member of the design engineering team responsible for various aspects of mechanical design, electronics packaging and general systems engineering.

Design work includes conceptual and detail design of machine components and assemblies, printed wiring boards and circuit card assemblies. Analysis work includes thermal, stress and vibration.

Concurrent engineering work environment where members of the mechanical, electrical, test and system engineering groups collaborate on design and development projects, as well as provide support to sustain production.

Work environment is SolidWorks 2016-2018, SW PDM, Altium, Mentor, ANSYS, Matlab and LabVIEW.

Candidate needs to have working knowledge of US standards and specifications for materials and processes currently used in the aerospace – defense industry.

Familiarity with the US Aerospace-Defense industry including participation to major air-land-sea development programs is a plus.

This is a senior level technical position, responsible for developing concepts, packaging and solutions to complex issues, performing trade studies, and overseeing development activities through integration into production.

Required Skills

Experience with SolidWorks 2016-2018 MCAD software for 3D models and 2D drawings

Experience with ALTIUM or MENTOR ECAD suite ( PADS / CAM350) for pwb design

Electronics packaging design experience

Familiar with both Military and Industry design standards. MIL-STD-810, DO160 and SAE, ASM, AISI, ASTM, IPC, MIL/DTL

Experience with designing machine parts and mechanical assemblies

Experience with mfg. processes

Experience with thermal, vibration and stress analysis (ANSYS modeling preferred)

Critical Competencies

Strong mechanical design and electronics packaging experience

Strong Engineering Analysis

Excellent oral and written communication skills

Drives for results, action-oriented

Team/group/project leadership experience

Required Experience

10+ years in Mechanical and Electronic Packaging design and development

Experience with defense / aerospace hardware

Printed wiring board / circuit card assembly experience

B.S. in Mechanical Engineering, M.S. preferred

Must be legally authorized to work in the U.S., visa sponsorship not available

Available to travel for customer and/or internal reviews and meetings (up to 15%)

Must be able to work on U.S. government programs and/or obtain security clearance in the future

Tue, 16 Apr 2019 05:57:10 GMT

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